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VIHAAN Chip

Published 15 Aug 2026. Access the PDF directly or read the stored explanation below.

UPSC Daily Current Affairs Science & Technology English 15 Aug 2026

VIHAAN Chip

Prelims:

Science & Technology

Mains:

GS Paper III: Science & Technology

Current relevance:

Aheesa Digital Innovations, a Chennai-based fabless semiconductor startup supported under the Design Linked Incentive (DLI) Scheme, has achieved first-pass silicon success with ‘VIHAAN’, a networking System-on-Chip (SoC) designed for fibre broadband using the indigenous VEGA microprocessor. The chip is expected to proceed towards production tape-out targeted for 2027.


 

Highlights:

About VIHAAN:

1.        Indigenous Broadband Chip: VIHAAN is a networking System-on-Chip (SoC) purpose-built for fibre broadband.

2.      Indigenous Technology: It has been built using the indigenous VEGA microprocessor.

3.      Developer: Designed by Aheesa Digital Innovations, a Chennai-headquartered Indian fabless semiconductor startup specialising in chips for broadband networking and security.

4.      Development Milestone: The chip was taped out on Republic Day and achieved first-pass silicon success on Independence Day.

5.      Next Stage: It will proceed towards production tape-out, targeted for 2027.


Design Linked Incentive (DLI) Scheme – Role:

1.        The DLI Scheme supports Indian startups in designing semiconductor chips for strategic and commercial applications.

2.      Supported applications include satellite communications, drones, surveillance cameras, defence and aerospace systems, automotive, IoT devices, LED drivers, AI systems, telecom equipment and smart meters.

3.      DLI-supported companies have collectively achieved over 30 chip-design tape-outs across various foundries.

4.      These companies have raised more than US$100 million in venture capital funding, indicating growing investor confidence in India's semiconductor design capabilities.

5.      Aheesa raised around ₹40 crore from TNIFMC through the Tamil Nadu Emerging Sector Seed Fund (TNESSF) and other private investors.


Strengthening India’s Chip-Design Ecosystem:

1.        High Value Addition: Semiconductor chip design contributes up to 50% of overall value addition across the semiconductor value chain.

2.      Electronic Products: Semiconductor design accounts for approximately 15–35% of the Bill of Materials (BOM) cost of electronic products.

3.      Design Infrastructure: State-of-the-art chip-design tools have been provided to 455 organisations, comprising 350 academic institutions and 105 startups.

4.      Academic Ecosystem: Under the Chips to Startup (C2S) Programme, 245 chip designs have been taped out by 71 academic institutions to support future workforce requirements.

5.      Commercialisation: Indian-designed chips are increasingly progressing from laboratories to fabrication, testing, validation and customer trials.


Other Recent DLI-Supported Successes:

1.        Vervesemi Microelectronics: Achieved first-pass silicon success for its BLDC Motor Controller chip using an indigenous microprocessor by Incore Semiconductor, along with its Motor Driver chip.

2.      Netrasemi: Successfully tested a 12nm Vision SoC with integrated video analytics acceleration.

3.      OptoML: Received its 12nm compute-in-memory SoC, designed for faster and more power-efficient AI processing.

4.      Mindgrove Technologies: Partnered with PRAMA India to explore the use of its Vision SoC in CCTV surveillance cameras.

5.      IndieSemiC: Secured global certification for its Bluetooth (BLE 6) chip module.


Significance for India:

1.        Digital Infrastructure: Indigenous broadband chips can support India's expanding optical fibre, 5G and broadband-led services.

2.      Technological Self-Reliance: Domestic semiconductor design strengthens self-reliance and domestic supply chains in a strategically important technology.

3.      Deep-Tech Investment: Growing venture-capital funding demonstrates increasing investor confidence in Indian semiconductor startups.

4.      Complete Semiconductor Ecosystem: Government initiatives seek to build capabilities across chip design, manufacturing, advanced packaging, equipment, materials, R&D and skilled manpower.

5.      Semicon 2.0: Approved in July 2026 with an outlay of ₹1,27,500 crore, it seeks to take India's efforts towards building a globally competitive semiconductor ecosystem to the next level.

 

Source: PIB - https://www.pib.gov.in/PressReleasePage.aspx?PRID=2299883&reg=48&lang=2

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